TechMeme April 9, 2026
TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reportedly reserved most of the capacity (Katie Tarasov/CNBC)
TSMC's CoWoS chip packaging tech is growing at an 80% CAGR. Nvidia has reserved most of the capacity. CoWoS is a crucial step in the chipmaking process for artificial intelligence.