TSMC backs ASML’s plan for bigger masks so its newest machines can print AI’s biggest chips
ThinkingNews Desk · how this was written
Samsung and TSMC have committed to using ASML’s High-NA EUV lithography machines, with Samsung targeting deployment by 2028 and TSMC by 2030, joining Intel in the same plan. All four manufacturers will transition from 6-inch to 12-inch photomasks, with testing slated for 2031 and volume production expected in 2033, promising up to a 40% productivity gain.
Written from all 3 reports below, not from any single one.
How it was reported
- TechMeme·Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks (Bloomberg)
Samsung and TSMC have pledged to adopt ASML’s High-NA extreme-ultraviolet lithography tools, targeting deployment by 2028 for Samsung and 2030 for TSMC, aligning with Intel’s similar plan. All four manufacturers will transition from 6-inch to 12-inch photomask formats to support the new equipment.
- The Next Web·TSMC backs ASML’s plan for bigger masks so its newest machines can print AI’s biggest chips
ASML will double photomask size from 6 inches to 12 inches so its High-NA EUV tools can expose the ~800 mm2 AI processors in a single shot, eliminating stitching seams and boosting throughput by about 40%. TSMC has joined the initiative, planning High-NA production on 6-inch masks from 2030, a pilot 12-inch mask line in 2031, and full-node deployment by 2033.
- Engadget·Samsung and TSMC hope AMSL's new machines will help address the chip shortage
Samsung and TSMC will adopt ASML’s High-NA EUV lithography machines, targeting deployment in 2028 and 2030 respectively, and join Intel in using the technology that has already produced over a million wafers. Both firms also entered a consortium to switch from 6-inch to 12-inch photomasks, with testing slated for 2031 and volume production expected in 2033, promising up to a 40% productivity gain and lower stitching-related costs.
Related stories
- Microsoft’s latest AI chip goes head-to-head with Amazon and Google3 outlets
- Sources: Apple plans to skip higher-end M6 chips and launch its next Pro and Max chips in 2027 as part of the M7 lineup, to boost on-device AI capabilities (Mark Gurman/Bloomberg)4 outlets
- Morphotonics raises €40M to expand its display tech into data centers3 outlets
- Build for the new AI era with Microsoft and NVIDIA3 outlets