Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks (Bloomberg)

Samsung and TSMC have pledged to adopt ASML’s High-NA extreme-ultraviolet lithography tools, targeting deployment by 2028 for Samsung and 2030 for TSMC, aligning with Intel’s similar plan. All four manufacturers will transition from 6-inch to 12-inch photomask formats to support the new equipment.