Samsung and TSMC hope AMSL's new machines will help address the chip shortage

Samsung and TSMC will adopt ASML’s High-NA EUV lithography machines, targeting deployment in 2028 and 2030 respectively, and join Intel in using the technology that has already produced over a million wafers. Both firms also entered a consortium to switch from 6-inch to 12-inch photomasks, with testing slated for 2031 and volume production expected in 2033, promising up to a 40% productivity gain and lower stitching-related costs.