SK Hynix breaks ground for its $4B advanced memory chip packaging facility in Indiana, with mass production of next-generation HBM scheduled to begin in H2 2029 (Bloomberg)

SK Hynix held a groundbreaking ceremony for a $4 billion advanced memory-chip packaging plant in Indiana, targeting mass production of next-generation high-bandwidth memory (HBM) in the second half of 2029. The facility will employ advanced packaging technologies to boost HBM density and performance for data-center and AI workloads.