SK Hynix breaks ground on a $4B memory packaging hub in Indiana

SK Hynix is constructing a $4 billion, 133.5-acre memory-packaging plant in West Lafayette, Indiana, with a cleanroom slated for October 2028 and mass production of next-generation high-bandwidth memory planned for late 2029. The facility will employ about 1,000 workers and is funded with up to $458 million in direct subsidies and up to $500 million in loans from the U.S. CHIPS and Science Act, marking the company’s first U.S. packaging base.