Xiaomi’s new Xring O3 is built at TSMC, and aimed at a few hundred thousand phones

Xiaomi’s Xring O3 SoC, fabricated by TSMC on its 3-nm process, integrates computing, graphics, AI and imaging onto a single die and will power the company’s upcoming flagship folding phone, with shipments projected at 200,000-300,000 units. The limited volume mirrors Xiaomi’s earlier Xring O1 rollout and serves to demonstrate in-house chip capability rather than replace Qualcomm or MediaTek in mass-market devices.