5 家媒体·5 篇报道·历时 5h
苹果称已与博通达成30亿美元以上的协议,未来五年在美国生产150亿颗芯片,这是其6000亿美元美国投资计划中的最大承诺(Rolfe Winkler/华尔街日报)
苹果同意与博通签订价值30亿美元以上的合同,未来五年在美国制造150亿颗芯片。该交易是苹果6000亿美元美国投资计划的一部分,芯片将在美国生产,并将包括新的无线组件。
本文综合以下全部报道写成,而非依据任何单一来源。
本页由机器翻译生成,原始报道为其原文语言。
各家媒体如何报道
- TechMeme·Apple says it reached a $30B+ deal with Broadcom to produce 15B chips on US soil in the next five years, its largest pledge as part of its $600B US investments (Rolfe Winkler/Wall Street Journal)
- Hacker News·Apple to increase spend with Broadcom to produce billions more U.S. chips
- The Next Web·Apple puts a $30bn US-manufacturing flag on its Broadcom chip deal
- Engadget·Apple pledges to buy $30 billion of Broadcom's US-made chips
- TechCrunch·Apple to produce Made in America wireless chips with Broadcom